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Description

Specification

General - Inch (mm)

Advanced - Inch (mm)

Material FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) / Polyimide
Max Layer Count 40 Layers
Min Cu Foil Thickness 1/3 oz (12)
Min Dielectric Thickness 0.004" (0.1mm)
Via Hole Plugging Via Hole Plugging
Min Board Thickness (a) 0.015"(0.4mm) Min Board Thickness (a)
Max Board Thickness (b) 0.25"(6.4mm)
Board Thickness Tolerance (%) ±10% ~ ±5%
Layer to Layer Registration ±0.005" (±0.127mm ) ±0.004" (±0.1mm)
Impedance Control (+/- %) ±10%
Max Warpage 0.008" (0.2mm) 0.006" (0.15mm)

Images

Min Trace Width (a) 0.006"(0.15mm) Min Trace Width (a) 0.004"(0.1mm) Min Trace Width (a)
Min Space Width (b) 0.005"(0.127mm) 0.004"(0.1mm)
Min Annular Ring 0.006"(0.15mm) in Annular Ring 0.004"(0.1mm) in Annular Ring
SMD Pitch (a) 0.02"(0.5mm) SMD Pitch (a) 0.012"(0.3mm) SMD Pitch (a)
BGA Pitch (b) 0.03"(0.8mm) 0.02"(0.5mm)
Pattern Plating OK

Solder Mask

Min Solder Mask Dam (a) 0.006"(0.15mm) Min Solder Mask Dam (a) 0.004"(0.1mm) Min Solder Mask Dam (a)
Soldermask Clearance (b) 0.006"(0.15mm) 0.004"(0.1mm)
Min SMT Pad spacing (c) 0.007"(0.18mm) 0.006"(0.127mm)
Solder Mask Thickness 0.0007"(0.018mm)

Holes

Min Hole Size (a) 0.008"(0.2mm) Min Hole Size (a)
Max Hole Size (a) 0.257"(6.5mm)
Hole to Hole Space (b) 0.01" ~ 0.008"(0.254 ~ 0.2mm)
Hole Size Tol (+/-) ±0.003"(±0.0762mm) ±0.002"(±0.05mm)
Aspect Ratio '10 : 1 '12 : 1
Hole Registration 0.002"(0.05mm)
Via on PTH OK
Via in Pad OK

Plating

HASL 0.3u"~0.34u" (7.0 ~ 8.0)
Immersion Tin 0.030u"~0.050u" (0.762 ~ 1.27)
Immersion Gold 0.002u"~0.003u" (0.05 ~ 0.0762)
Gold Finger 0.030u"~0.050u" (0.762 ~ 1.27)
Nickel Plating 0.15u"~0.2u" (3.81 ~ 5.08)
Electrolityc Hard Gold 0.067u" (1.7)

Outline

Tooling Hole to Routed Edge Registration (+/-) ±0.005" (± 0.127)
Panel Outline Tol (+/-) 0.008" (0.2)
Guide Rail 0.4" (10mm)
Beveling 20, 30', 45'

Panel

Max Size 27.6" x 23.6" (700mm x 600mm)